DesignCon, the premier conference for chip, board, and systems design engineers, returns to Silicon Valley for its 22nd year. It serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. There are more than 100 sessions spanning 14 tracks and the Technical Conference Program covers all aspects of electronic design, from chips through boards and systems.
The award winning paper was titled "Analysis on EMI Related Common‐mode Noise of SERDES Transmitter". This work was a result of the joint project between HUAWEI Corporation, Shenzhen and High Speed Silicon Lab, HKUST, executed by Duona Luo and supervised by Prof. Patrick Yue