•Svante Bergman,
•Antonio De Maio,
•Silvio De Nicola,
•Alfonso Farina,
•Yi Jiang,
•David Julian,
•Daniel O’Neill,
•Jiaheng Wang,
•Shuzhong Zhang,
•Xi Zhang,
University of Rome “La Sapienza”, Rome, Italy.
Royal Institute of Technology (KTH), Stockholm, Sweden.
Royal Institute of Technology (KTH), Stockholm, Sweden.
IESE Business School, Barcelona, Spain.
Princeton University, Princeton, NJ, USA.
Stanford University, Stanford, CA, USA.
University of Napols "Federico II", Napols, Italy.
University of Napols "Federico II", Napols, Italy.
Technion - Israel Institute of Technology, Haifa, Israel.
University of Rome "La Sapienza", Rome, Italy.
SELEX - Sistemi Integrati, Rome, Italy.
Technical Univ. of Catalonia (UPC), Barcelona, Spain.
Hong Kong Baptiste University, Hong Kong.
NextWave Broadband, San Diego, CA, USA.
Qualcomm, San Diego, CA, USA.
Centre Technològic de Telecomunications de Catalunya (CTTC), Barcelona, Spain.
Sun Microsystems, Santa Clara, CA, USA.
Technical Univ. of Catalonia (UPC), Barcelona, Spain.
Royal Institute of Technology (KTH), Stockholm, Sweden.
Technical Univ. of Catalonia (UPC), Barcelona, Spain.
University of Illinois at Urbana-Champaign, IL, USA.
Technical Univ. of Catalonia (UPC), Barcelona, Spain.
Centre Technològic de Telecomunications de Catalunya (CTTC), Barcelona, Spain.
Centre Technològic de Telecomunications de Catalunya (CTTC), Barcelona, Spain.
University of Cantabria, Spain.
University of Illinois at Urbana-Champaign (UIUC), IL, USA.
University of Colorado, Boulder, CO, USA.
Princeton University, Princeton, NJ, USA.
University of Cantabria, Spain.
Technical Univ. of Catalonia (UPC), Barcelona, Spain.
University of Cantabria, Spain.
Royal Institute of Technology (KTH), Stockholm, Sweden.
City University of Hong Kong, Hong Kong.
The Chinese University of Hong Kong (CUHK), Hong Kong.
McKinsey, Sweden.